Hi, I have been stuck for a while to get the proper methodology on modelling wood frame or wood stud (light timber frame) walls in TRNSYS. So these walls have dimensioned studs at specified spacing with cavity insulation within them. So the wood stud layer has two materials in it. How can we model such a layer/wall in TRNSYS. Because in TRNSYS, you only get to input one value for specific heat capacity, density and conductivity.... Hence what should I do to model this sort of a wood frame wall where i need to consider the thermal capacitance of wood, U value of wood and the U value of cavity insulation as well.